Chip high and low temperature shock heat flux meter

Q: What is a chip high and low temperature shock heat flux meter?
A: It is a precision sensor used to accurately measure the heat flux density across the surface of small devices such as chips during rapid high and low temperature changes (thermal shock).

Q: What is its primary working principle?
A: The core principle is based on the Seebeck effect. The sensor chip contains micro-thermopiles that generate a voltage signal when a temperature difference occurs across the chip, which is proportional to the heat flux density.

Q: Why is a specialized "shock" heat flux meter needed?
A: Ordinary heat flux meters have slow response times. The "shock" type requires extremely high response speed and stability to capture transient thermal changes without lag or distortion.

Q: What is its most critical performance metric?
A: Thermal response time—how quickly the sensor reacts to temperature changes—typically required to be very short (millisecond level).

Q: In which fields is it primarily used?
A: Electronic chip reliability testing, battery pack thermal management testing, aerospace material thermal fatigue testing, LED lamp heat dissipation performance evaluation, etc.

Q: How do I choose the right temperature range for my test?
A: Select based on your test standards. Common ranges include -80°C to +200°C or more extreme ones like -185°C to +300°C, covering the limits of your experimental conditions.

Q: How is this micro heat flux meter chip installed?
A: It is usually attached closely to the surface of the device under test using thermal paste or mechanical pressure to ensure good thermal contact and minimal measurement error.

Q: What data does it measure?
A: Two core data points: heat flux density (W/m² or W/cm²) and the sensor’s own temperature (°C).

Q: Is its calibration complicated?
A: Relatively complex. It requires specialized standard heat source equipment to establish a function between voltage output and known standard heat flux. Regular calibration by the manufacturer or certified institutions is recommended.

Q: Besides heat flux, what else can it measure?
A: Through its temperature measurement function, it can indirectly analyze parameters such as thermal conductivity and contact thermal resistance.

Q: How does it differ from a thermal imager?
A: A thermal imager measures surface temperature distribution (2D)—the result. A heat flux meter measures the rate of energy transfer (1D)—the process. The two are often used complementarily.

Q: What specifications should I consider when purchasing?
A: Focus on: range, sensitivity, response time, accuracy, operating temperature range, chip size, and packaging durability.

Q: What are common sources of error during testing?
A: Mainly contact thermal resistance (poor contact between the sensor and the surface), the sensor’s disturbance of the thermal field, and temperature change rates exceeding its response capability.

Q: What is its service life?
A: It depends on the usage environment. Frequent extreme thermal shocks accelerate aging. Regular sensitivity calibration is advised, and replacement is necessary after exceeding the calibration cycle or physical damage.

Q: What are the requirements for the data acquisition system?
A: A high-resolution, high-sample-rate data acquisition card is needed to accurately record the rapidly changing tiny voltage signals during thermal shock.