Çin, Guangdong Eyaleti, Dongguan Şehri, Hongmei Kasabası, Shugang Caddesi, No. 3, Kat 1

20 yıllık çevresel test odası üreticisiDünya genelinde 3000+ müşteri teslimatı           E-posta: shirley@deruitest.com
Küresel Danışma Hattı:+86 15580327593

Çip Yüksek ve Düşük Sıcaklık Şok Isı Akış Ölçer

The DERUI semiconductor temperature forcing system delivers rapid hot and cold air directly to ICs, memory, PCBs and optical modules for powered DUT characterization, failure analysis and ATE testing.

Air Range: −65°C to +225°C
Changeover: −55°C to +125°C in 13 s (stated air-stream transition)
Air Flow: Up to 18 SCFM
Control: ±1°C stated; 0.1°C display resolution
Cooling: Mechanical refrigeration; no liquid nitrogen stated
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Localized Thermal Stream for DUT Testing

Rapid Temperature Forcing for Semiconductor and Electronics Validation

The DERUI semiconductor temperature forcing system delivers a controlled hot or cold air stream directly to a device under test. It supports fast characterization of ICs, memory, PCBs, optical modules and 5G components while the DUT remains connected to electrical test equipment.

−65°C to +225°CStated outlet-air operating range
13 s ChangeoverStated −55°C to +125°C air transition
Up to 18 SCFMConditioned-air flow
No LN₂ RequiredMechanical refrigeration system
Correct Product Category

This Is a Temperature Forcing System—not a Heat Flux Meter

A heat flux meter measures heat-transfer rate per unit area. This equipment instead creates and controls a localized thermal environment around a DUT. The technically correct search terms are temperature forcing system, thermal stream or thermostream system.

IC Characterization

Measure functional and electrical behavior at hot, cold and intermediate case-temperature conditions.

Memory and Storage

Test Flash, eMMC and related devices for startup, timing and data performance across temperature.

5G and Optical Modules

Condition SFP/transceiver modules, RF devices and communication boards while connected to ATE or a functional test setup.

Important measurement boundary: outlet-air temperature, DUT case temperature and semiconductor junction temperature are different values. Define which temperature controls the test and where the feedback sensor is installed.
Nasıl Çalışır

Focused Hot and Cold Air Around the DUT

1

Generate the Air Stream

Mechanical refrigeration and electric heating condition the process air over the selected operating range.

2

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Soğutma yöntemi Mechanical refrigeration; no liquid nitrogen stated
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Selection Checklist

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Laboratory Utilities

Supply voltage, compressed/dry-air requirement, heat rejection, exhaust, noise limit and available floor/bench space.

Typical Workflow

Integrating Thermal Stream with ATE

1

Characterize the Setup

Verify sensor placement, shroud sealing and the relationship between air, case and any estimated junction temperature.

2

Run the Sequence

Command the target, wait for the agreed stabilization rule, execute the electrical test and record temperatures with results.

3

Return Safely

Warm the DUT above the condensation-risk point before opening the shroud or removing it from dry-air protection.

Sıkça Sorulan Sorular

Semiconductor Temperature Forcing System FAQs

What is a semiconductor temperature forcing system?

It delivers controlled hot or cold air to a localized DUT so electrical behavior can be measured at selected temperatures without conditioning a full chamber.

Is it a heat flux meter?

No. It does not primarily measure heat flux in W/m². It is a thermal-stream source and temperature-control system.

Does the DUT reach −55°C to +125°C in 13 seconds?

Not necessarily. The figure describes the stated air transition. DUT stabilization depends on thermal mass, power, fixture, airflow, sensor and tolerance.

Why use it instead of a temperature chamber?

It provides faster localized conditioning and easier access to probes, sockets and ATE, making it useful for device characterization and failure analysis.

Can it control junction temperature?

Directly controlling junction temperature requires a suitable electrical sensing or thermal model. Standard setups more commonly control air or package-case temperature.

Does it require liquid nitrogen?

The supplied specification states mechanical refrigeration without LN₂. The system still contains a closed refrigeration circuit; refrigerant type and service details should be confirmed.

How is condensation prevented?

Use dry conditioned air, a well-sealed shroud, controlled purge and warm-up, and keep the DUT protected until it is above the ambient dew point.

What should I send for selection?

Provide DUT/fixture drawings, power dissipation, target temperature, sensor/control point, transition and stability requirements, test sequence and laboratory utilities.

Configure the Thermal Stream Around Your DUT

Send DERUI your device, socket and fixture drawings, power dissipation, temperature profile, feedback method and ATE sequence. We will review the nozzle/shroud, airflow and control configuration.

Request a DUT Thermal Review

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Sıcaklık aralığı
-65 °C ila + 225 °C
Tipik sıcaklık dönüşüm oranı
"-55°C ila + 125 "C;≤; 13 saniye
Sıcaklık kontrol doğruluğu
± 1 °C
Görüntüle/ayarla hassasiyet
± 0.1 °C
Sistem gaz akış hızı
4-18 SCEM (1.9L/s-8.5L/s)
Sistem işletimi
Hd Renk dokunmatik ekran, 7" TET
Sistem dili
Çince/İngilizce
İşletim modu
Manuel mod veya program modu
Algılama modu
Hava, DUT
Sıcaklık kontrolü
İç: TC; Uzaktan/dış: T, K; İsteğe bağlı: RTD
İletişim arayüzü
RS-232, LAN; İsteğe bağlı: GPIB
soğutucu
HCFC çevresel soğutucu
Kaldırma kontrolü
Kaldırma çubuğu: elektrikli; BAŞLIK: pnömatik kontrol; Bu işlem yerel veya uzaktan arayüz üzerinden gerçekleştirilir
Kol uzatma
X: 1300mm, Y: 400mm, Z: 360°
Isı kalkanı boyutu
Standart: 140mm; Diğer: Ф74mm/Ф178mm (çeşitli boyutlarda özelleştirme sağlar)
Ana motor boyutu
638mm * 970mm * 970mm (uzunluk * genişlik * yükseklik)
gürültü
≤59DBA
ağırlık
205KG
Güç gereksinimleri
220VAC/50Hz, 30Amper, 1 Faz
Hava kaynağı gereksinimi
 
gaz
Temiz hava: yağ molekülleri, nem ve partiküllerden arındırılmış
Emme sıcaklığı
+15 °C ile +25 °C arasında
Emme basıncı
90-110 Psig (6.2-7.6Bar)
Emme akış hızı
15-30 SCFM (7.2 ila 14.3L/s), standart 25SCFM (11.8L/s)
Çiğlenme noktası
< 10°C@ 6.2Bar (90Psi), çiğlenme noktası -20°C'nin altında olan kuru gaz önerilir
Gazın yağ içeriği
≤ 0.01 ppm, 0.01 mikron filtre ile yağ kirliliği
Çalışma ortamı gereksinimleri
 
sıcaklık
+15 °C ile +25 °C arasında
Bağıl nem
20% ile 65%
  1. S: Çip yüksek ve düşük sıcaklık şok ısı akısı ölçer nedir?
    A: Bu, çip gibi küçük cihazların yüzeyi boyunca ısı akısı yoğunluğunu hızlı yüksek ve düşük sıcaklık değişimleri (termal şok) sırasında doğru şekilde ölçmek için kullanılan hassas bir sensördür.

  2. S: Temel çalışma prensibi nedir?
    A: Temel prensip, Seebeck etkisi. üzerine kuruludur. Sensör çipi, çip boyunca bir sıcaklık farkı oluştuğunda voltaj sinyali üreten mikro-termopil içerir ve bu sinyal ısı akısı yoğunluğuna orantılıdır.

  3. S: Neden özel bir "şok" ısı akısı ölçer gerekiyor?
    A: Olağan ısı akısı ölçerler yavaş tepki sürelerine sahiptir. "Şok" tipi, geçici termal değişiklikleri gecikme veya bozulma olmadan yakalamak için son derece yüksek tepki hızı ve stabilite gerektirir.

  4. S: En kritik performans metriği nedir?
    A: Termal yanıt süresi—sensörün sıcaklık değişikliklerine ne kadar hızlı tepki verdiği—genellikle çok kısa olması gerekir (milisaniye seviyesinde).

  5. S: Hangi alanlarda öncelikle kullanılır?
    A: Elektronik çip güvenilirlik testi, batarya paketi termal yönetim testi, havacılık malzemeleri termal yorgunluk testi, LED lamba ısı dağılımı performans değerlendirmesi vb.

  6. S: Testim için doğru sıcaklık aralığını nasıl seçerim?
    A: Test standartlarınıza göre seçin. Yaygın aralıklar -80°C ile +200°C arasında veya daha ekstrem olanlar -185°C ile +300°C arasındadır ve deneysel koşullarınızın sınırlarını kapsar.

  7. S: Bu mikro ısı akısı ölçer çip nasıl kurulur?
    A: Genellikle termal macun veya mekanik baskı kullanılarak test edilen cihazın yüzeyine yakın şekilde yapıştırılır, iyi termal temas ve minimum ölçüm hatası sağlamak için.

  8. S: Hangi verileri ölçer?
    A: İki temel veri noktası: ısı akısı yoğunluğu (W/m² veya W/cm²) ve sensörün kendi sıcaklığı (°C).

  9. S: Kalibrasyonu karmaşık mı?
    A: Göreceli olarak karmaşık. Voltaj çıkışı ile bilinen standart ısı akısı arasında bir fonksiyon kurmak için özel standart ısı kaynağı ekipmanı gerektirir. Üretici veya sertifikalı kurumlar tarafından düzenli kalibrasyon önerilir.

  10. S: Isı akısı dışında başka ne ölçebilir?
    A: Sıcaklık ölçüm fonksiyonu aracılığıyla dolaylı olarak analiz edilebilir parametreler: termal iletkenlik ve temas termal direnci.

  11. S: Termal görüntüleme cihazından nasıl farklıdır?
    A: Bir termal görüntüleyici yüzey sıcaklığı dağılımını (2D) ölçer—sonuç. Bir ısı akısı ölçer enerji transfer hızını (1D) ölçer—süreç. İkisi genellikle tamamlayıcı olarak kullanılır.

  12. S: Satın alırken hangi özellikleri dikkate almalıyım?
    A: Odaklanın: menzil, hassasiyet, yanıt süresi, doğruluk, çalışma sıcaklığı aralığı, çip boyutu ve paketleme dayanıklılığı.

  13. S: Test sırasında yaygın hata kaynakları nelerdir?
    A: Başlıca temas termal direnci (sensör ile yüzey arasındaki kötü temas), sensörün termal alanı bozması ve yanıt kapasitesini aşan sıcaklık değişim hızları.

  14. S: Hizmet ömrü nedir?
    A: Kullanım ortamına bağlıdır. Sık sık aşırı termal şoklar yaşlanmayı hızlandırır. Düzenli hassasiyet kalibrasyonu önerilir ve kalibrasyon döngüsünü aştıktan veya fiziksel hasar oluştuğunda değiştirilmelidir.

  15. S: Veri toplama sisteminin gereksinimleri nelerdir?
    A: Hızla değişen küçük voltaj sinyallerini doğru şekilde kaydetmek için yüksek çözünürlüklü, yüksek örnekleme hızına sahip veri toplama kartı gereklidir.

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