Chambre d'essai de choc thermique

Thermomètre de choc thermique haute et basse température pour puce et flux de chaleur

Le DERUI semiconductor temperature forcing system delivers rapid hot and cold air directly to ICs, memory, PCBs and optical modules for powered DUT characterization, failure analysis and ATE testing.

Air Range: −65°C to +225°C

Changeover: −55°C to +125°C in 13 s (stated air-stream transition)

Air Flow: Up to 18 SCFM

Control: ±1°C stated; 0.1°C display resolution

Cooling: Mechanical refrigeration; no liquid nitrogen stated

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Localized Thermal Stream for DUT Testing

Rapid Temperature Forcing for Semiconductor and Electronics Validation

The DERUI semiconductor temperature forcing system delivers a controlled hot or cold air stream directly to a device under test. It supports fast characterization of ICs, memory, PCBs, optical modules and 5G components while the DUT remains connected to electrical test equipment.

−65°C to +225°CStated outlet-air operating range

13 s ChangeoverStated −55°C to +125°C air transition

Up to 18 SCFMConditioned-air flow

No LN₂ RequiredMechanical refrigeration system

Correct Product Category

This Is a Temperature Forcing System—not a Heat Flux Meter

A heat flux meter measures heat-transfer rate per unit area. This equipment instead creates and controls a localized thermal environment around a DUT. The technically correct search terms are temperature forcing system, thermal stream or thermostream system.

IC Characterization

Measure functional and electrical behavior at hot, cold and intermediate case-temperature conditions.

Memory and Storage

Test Flash, eMMC and related devices for startup, timing and data performance across temperature.

5G and Optical Modules

Condition SFP/transceiver modules, RF devices and communication boards while connected to ATE or a functional test setup.

Important measurement boundary: outlet-air temperature, DUT case temperature and semiconductor junction temperature are different values. Define which temperature controls the test and where the feedback sensor is installed.

Comment ça fonctionne

Focused Hot and Cold Air Around the DUT

1

Generate the Air Stream

Mechanical refrigeration and electric heating condition the process air over the selected operating range.

2

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Méthode de refroidissement	Mechanical refrigeration; no liquid nitrogen stated
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Selection Checklist

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Laboratory Utilities

Supply voltage, compressed/dry-air requirement, heat rejection, exhaust, noise limit and available floor/bench space.

Typical Workflow

Integrating Thermal Stream with ATE

1

Characterize the Setup

Verify sensor placement, shroud sealing and the relationship between air, case and any estimated junction temperature.

2

Run the Sequence

Command the target, wait for the agreed stabilization rule, execute the electrical test and record temperatures with results.

3

Return Safely

Warm the DUT above the condensation-risk point before opening the shroud or removing it from dry-air protection.

Foire Aux Questions

Semiconductor Temperature Forcing System FAQs

What is a semiconductor temperature forcing system?

It delivers controlled hot or cold air to a localized DUT so electrical behavior can be measured at selected temperatures without conditioning a full chamber.

Is it a heat flux meter?

No. It does not primarily measure heat flux in W/m². It is a thermal-stream source and temperature-control system.

Does the DUT reach −55°C to +125°C in 13 seconds?

Not necessarily. The figure describes the stated air transition. DUT stabilization depends on thermal mass, power, fixture, airflow, sensor and tolerance.

Why use it instead of a temperature chamber?

It provides faster localized conditioning and easier access to probes, sockets and ATE, making it useful for device characterization and failure analysis.

Can it control junction temperature?

Directly controlling junction temperature requires a suitable electrical sensing or thermal model. Standard setups more commonly control air or package-case temperature.

Does it require liquid nitrogen?

The supplied specification states mechanical refrigeration without LN₂. The system still contains a closed refrigeration circuit; refrigerant type and service details should be confirmed.

How is condensation prevented?

Use dry conditioned air, a well-sealed shroud, controlled purge and warm-up, and keep the DUT protected until it is above the ambient dew point.

What should I send for selection?

Provide DUT/fixture drawings, power dissipation, target temperature, sensor/control point, transition and stability requirements, test sequence and laboratory utilities.

Configure the Thermal Stream Around Your DUT

Send DERUI your device, socket and fixture drawings, power dissipation, temperature profile, feedback method and ATE sequence. We will review the nozzle/shroud, airflow and control configuration.

Request a DUT Thermal Review

Plage de température	-65 °C à + 225 °C	Taux de conversion de température typique	"-55°C à + 125°C ;≤; 13 secondes
Précision du contrôle de la température	± 1 °C	Précision d'affichage/de réglage	± 0,1 °C
Débit de gaz du système	4-18 SCEM (1,9L/s-8,5L/s)
Fonctionnement du système	Écran tactile couleur HD, 7" TET	Langue du système	Chinois/Anglais
Mode de fonctionnement	Mode manuel ou mode programme	Mode de détection	Air, DUT
Contrôle de température	Interne : TC ; Externe/distant : T, K ; Optionnel : RTD
Interface de communication	RS-232, LAN ; Optionnel : GPIB
Réfrigérant	Réfrigérant environnemental HCFC
Contrôle de levage	Barre de levage : électrique ; TÊTE : contrôle pneumatique ; Cette opération est effectuée via une interface locale ou distante
Extension du bras	X : 1300mm, Y : 400mm, Z : 360°
Taille du bouclier thermique	Standard : 140mm ; Autre : Ф74mm/Ф178mm (fournir diverses tailles de personnalisation)
Taille du moteur principal	638mm * 970mm * 970mm (longueur * largeur * hauteur)
bruit	≤59DBA	poids	205KG
Exigences en alimentation électrique	220VAC/50Hz, 30Amp, 1Phase
Exigence en source d'air
gaz	Air propre : exempt de molécules d'huile, d'humidité et de particules
Température d'admission	+15 °C à +25 °C
Pression d'admission	90-110 Psig (6.2-7.6Bar)
Débit d'admission	15-30 SCFM (7.2 à 14.3L/s), standard 25SCFM (11.8L/s)
Point de rosée	＜ 10°C@ 6,2Bar (90Psi), un gaz sec avec un point de rosée inférieur à -20°C est recommandé
Contenu en huile du gaz	≤ 0,01 ppm, filtré à 0,01 micron pour la pollution huileuse
Exigences pour l'environnement de travail
température	+15 °C à + 25 °C	Humidité relative	20% à 65%

Q : Qu'est-ce qu'un débitmètre de flux de chaleur à choc thermique haute et basse température pour puces ?
A: Il s'agit d'un capteur de précision utilisé pour mesurer avec précision la densité de flux thermique à la surface de petits dispositifs tels que les puces lors de changements rapides de température haute et basse (choc thermique).
Q : Quel est son principe de fonctionnement principal ?
A: Le principe de base repose sur le Effet Seebeck. Le micro-capteur contient des micro-thermopiles qui génèrent un signal de tension lorsqu'une différence de température se produit à travers la puce, ce qui est proportionnel à la densité de flux thermique.
Q : Pourquoi un débitmètre de flux de chaleur "choc" spécialisé est-il nécessaire ?
A: Les débitmètres de flux de chaleur ordinaires ont des temps de réponse lents. Le type "choc" nécessite une vitesse de réponse extrêmement élevée et une stabilité pour capturer les changements thermiques transitoires sans retard ni distorsion.
Q : Quelle est sa métrique de performance la plus critique ?
A: Temps de réponse thermique— la rapidité avec laquelle le capteur réagit aux changements de température — doit généralement être très courte (niveau milliseconde).
Q : Dans quels domaines est-il principalement utilisé ?
A: Test de fiabilité des puces électroniques, test de gestion thermique des packs de batteries, test de fatigue thermique des matériaux aérospatiaux, évaluation des performances de dissipation thermique des lampes LED, etc.
Q : Comment choisir la bonne plage de température pour mon test ?
A: Sélectionnez en fonction de vos normes de test. Les plages courantes incluent -80°C à +200°C ou des plages plus extrêmes comme -185°C à +300°C, couvrant les limites de vos conditions expérimentales.
Q : Comment ce microcapteur de flux thermique est-il installé ?
A: Il est généralement fixé étroitement à la surface de l'appareil testé à l'aide de pâte thermique ou de pression mécanique pour assurer un bon contact thermique et minimiser l'erreur de mesure.
Q : Quelles données mesure-t-il ?
A: Deux points de données principaux : densité de flux thermique (W/m² ou W/cm²) et la propre température du capteur (°C).
Q : Son étalonnage est-il compliqué ?
A: Relativement complexe. Il nécessite un équipement spécialisé de source de chaleur standard pour établir une fonction entre la sortie de tension et le flux thermique standard connu. Un étalonnage régulier par le fabricant ou des institutions certifiées est recommandé.
Q : À part le flux thermique, que peut-il mesurer ?
A: Grâce à sa fonction de mesure de température, il peut analyser indirectement des paramètres tels que la conductivité thermique et la résistance thermique de contact.
Q : En quoi diffère-t-il d'une caméra thermique ?
A: Une caméra thermique mesure la distribution de la température de surface (2D) — le résultat. Un capteur de flux thermique mesure le taux de transfert d'énergie (1D) — le processus. Les deux sont souvent utilisés de manière complémentaire.
Q : Quelles spécifications dois-je considérer lors de l'achat ?
A: Concentrez-vous sur : plage, sensibilité, temps de réponse, précision, plage de température de fonctionnement, taille de la puce et durabilité de l'emballage.
Q : Quelles sont les sources courantes d'erreur lors des tests ?
A: Principalement la résistance thermique de contact (mauvais contact entre le capteur et la surface), la perturbation du champ thermique par le capteur, et les taux de changement de température dépassant sa capacité de réponse.
Q : Quelle est sa durée de vie ?
A: Cela dépend de l'environnement d'utilisation. Les chocs thermiques extrêmes fréquents accélèrent le vieillissement. Il est conseillé de calibrer régulièrement la sensibilité, et le remplacement est nécessaire après avoir dépassé le cycle de calibration ou en cas de dommage physique.
Q : Quelles sont les exigences pour le système d'acquisition de données ?
A: Une carte d'acquisition de données à haute résolution et à haut débit d'échantillonnage est nécessaire pour enregistrer avec précision les signaux de tension minuscules en évolution rapide lors du choc thermique.

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