Boden 1, Nr. 3, Shugang Avenue, Hongmei Town, Dongguan City, Guangdong Province, China

Hersteller von Umwelttestkammern seit 20 JahrenMehr als 3000 Kunden weltweit geliefert           E-Mail: shirley@deruitest.com
Globale Beratungs-Hotline:+86 15580327593

Chip-Hoch- und Niedertemperatur-Schock-Heat-Flux-Meter

Das DERUI semiconductor temperature forcing system delivers rapid hot and cold air directly to ICs, memory, PCBs and optical modules for powered DUT characterization, failure analysis and ATE testing.

Air Range: −65°C to +225°C
Changeover: −55°C to +125°C in 13 s (stated air-stream transition)
Air Flow: Up to 18 SCFM
Control: ±1°C stated; 0.1°C display resolution
Cooling: Mechanical refrigeration; no liquid nitrogen stated
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Localized Thermal Stream for DUT Testing

Rapid Temperature Forcing for Semiconductor and Electronics Validation

The DERUI semiconductor temperature forcing system delivers a controlled hot or cold air stream directly to a device under test. It supports fast characterization of ICs, memory, PCBs, optical modules and 5G components while the DUT remains connected to electrical test equipment.

−65°C to +225°CStated outlet-air operating range
13 s ChangeoverStated −55°C to +125°C air transition
Up to 18 SCFMConditioned-air flow
No LN₂ RequiredMechanical refrigeration system
Correct Product Category

This Is a Temperature Forcing System—not a Heat Flux Meter

A heat flux meter measures heat-transfer rate per unit area. This equipment instead creates and controls a localized thermal environment around a DUT. The technically correct search terms are temperature forcing system, thermal stream or thermostream system.

IC Characterization

Measure functional and electrical behavior at hot, cold and intermediate case-temperature conditions.

Memory and Storage

Test Flash, eMMC and related devices for startup, timing and data performance across temperature.

5G and Optical Modules

Condition SFP/transceiver modules, RF devices and communication boards while connected to ATE or a functional test setup.

Important measurement boundary: outlet-air temperature, DUT case temperature and semiconductor junction temperature are different values. Define which temperature controls the test and where the feedback sensor is installed.
Funktionsweise

Focused Hot and Cold Air Around the DUT

1

Generate the Air Stream

Mechanical refrigeration and electric heating condition the process air over the selected operating range.

2

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Kühlmethode Mechanical refrigeration; no liquid nitrogen stated
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Selection Checklist

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Laboratory Utilities

Supply voltage, compressed/dry-air requirement, heat rejection, exhaust, noise limit and available floor/bench space.

Typical Workflow

Integrating Thermal Stream with ATE

1

Characterize the Setup

Verify sensor placement, shroud sealing and the relationship between air, case and any estimated junction temperature.

2

Run the Sequence

Command the target, wait for the agreed stabilization rule, execute the electrical test and record temperatures with results.

3

Return Safely

Warm the DUT above the condensation-risk point before opening the shroud or removing it from dry-air protection.

Häufig gestellte Fragen

Semiconductor Temperature Forcing System FAQs

What is a semiconductor temperature forcing system?

It delivers controlled hot or cold air to a localized DUT so electrical behavior can be measured at selected temperatures without conditioning a full chamber.

Is it a heat flux meter?

No. It does not primarily measure heat flux in W/m². It is a thermal-stream source and temperature-control system.

Does the DUT reach −55°C to +125°C in 13 seconds?

Not necessarily. The figure describes the stated air transition. DUT stabilization depends on thermal mass, power, fixture, airflow, sensor and tolerance.

Why use it instead of a temperature chamber?

It provides faster localized conditioning and easier access to probes, sockets and ATE, making it useful for device characterization and failure analysis.

Can it control junction temperature?

Directly controlling junction temperature requires a suitable electrical sensing or thermal model. Standard setups more commonly control air or package-case temperature.

Does it require liquid nitrogen?

The supplied specification states mechanical refrigeration without LN₂. The system still contains a closed refrigeration circuit; refrigerant type and service details should be confirmed.

How is condensation prevented?

Use dry conditioned air, a well-sealed shroud, controlled purge and warm-up, and keep the DUT protected until it is above the ambient dew point.

What should I send for selection?

Provide DUT/fixture drawings, power dissipation, target temperature, sensor/control point, transition and stability requirements, test sequence and laboratory utilities.

Configure the Thermal Stream Around Your DUT

Send DERUI your device, socket and fixture drawings, power dissipation, temperature profile, feedback method and ATE sequence. We will review the nozzle/shroud, airflow and control configuration.

Request a DUT Thermal Review

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Temperaturbereich
-65 °C bis + 225 °C
Typische Temperaturumwandlungsrate
"-55°C bis + 125°C; ≤; 13 Sekunden
Temperaturregelungsgenauigkeit
± 1 °C
Anzeige/Set-Genauigkeit
± 0,1 °C
Systemgasflussrate
4-18 SCEM (1,9L/s-8,5L/s)
Systembetrieb
Hd Farb-Touchscreen, 7" TET
Systemsprache
Chinesisch/Englisch
Betriebsmodus
Manueller Modus oder Programmmodus
Erkennungsmodus
Luft, DUT
Temperaturregelung
Intern: TC; Fern/extern: T, K; Optional: RTD
Kommunikationsschnittstelle
RS-232, LAN; Optional: GPIB
Kältemittel
HCFC-Umweltkältemittel
Hubsteuerung
Hebestange: elektrisch; KOPF: pneumatische Steuerung; Dieser Betrieb erfolgt über eine lokale oder entfernte Schnittstelle
Armverlängerung
X: 1300mm, Y: 400mm, Z: 360°
Wärmeschutzschildgröße
Standard: 140mm; Andere: Ф74mm/Ф178mm (verschiedene Größen auf Anfrage)
Hauptmotorgröße
638mm * 970mm * 970mm (Länge * Breite * Höhe)
Geräusch
≤59DBA
Gewicht
205KG
Stromanforderungen
220VAC/50Hz, 30Amp, 1Phase
Luftquellenanforderung
 
Gas
Reine Luft: frei von Ölmolekülen, Feuchtigkeit und Partikeln
Ansaugtemperatur
+15 °C bis +25 °C
Ansaugdruck
90-110 Psig (6.2-7.6Bar)
Ansaugluftstrom
15-30 SCFM (7.2 bis 14.3L/s), Standard 25SCFM (11.8L/s)
Taupunkt
< 10°C bei 6.2Bar (90Psi), es wird ein trockenes Gas mit einem Taupunkt unter -20°C empfohlen
Ölgehalt in der Luft
≤ 0,01 ppm, Filter auf 0,01 Mikron Ölverschmutzung
Anforderungen an die Arbeitsumgebung
 
Temperatur
+15 °C bis +25 °C
Relative Luftfeuchtigkeit
20% bis 65%
  1. F: Was ist ein Chip-Hoch- und Tieftemperatur-Schock-Wärmeflussmesser?
    A: Es ist ein Präzisionssensor, der verwendet wird, um die Wärmestromdichte auf der Oberfläche kleiner Geräte wie Chips während schneller Hoch- und Tieftemperaturwechsel (Thermoschock) genau zu messen.

  2. F: Was ist sein primäres Arbeitsprinzip?
    A: Das Kernprinzip basiert auf dem Seebeck-Effekt. Der Sensorschip enthält Mikro-Thermopile, die eine Spannung erzeugen, wenn ein Temperaturunterschied über den Chip auftritt, was proportional zur Wärmestromdichte ist.

  3. F: Warum wird ein spezieller "Schock"-Wärmeflussmesser benötigt?
    A: Gewöhnliche Wärmeflussmesser haben langsame Reaktionszeiten. Der "Schock"-Typ erfordert eine extrem hohe Reaktionsgeschwindigkeit und Stabilität, um transienten thermischen Veränderungen ohne Verzögerung oder Verzerrung zu erfassen.

  4. F: Was ist seine wichtigste Leistungskennzahl?
    A: Thermische Reaktionszeit—wie schnell der Sensor auf Temperaturänderungen reagiert—ist in der Regel sehr kurz (Millisekundenbereich).

  5. F: In welchen Bereichen wird er hauptsächlich eingesetzt?
    A: Zuverlässigkeitstests für elektronische Chips, thermisches Management von Batteriepacks, thermische Ermüdungstests von Luft- und Raumfahrtmaterialien, Bewertung der Wärmeabfuhrleistung von LED-Lampen usw.

  6. F: Wie wähle ich den richtigen Temperaturbereich für meinen Test?
    A: Wählen Sie basierend auf Ihren Teststandards. Gängige Bereiche sind -80°C bis +200°C oder extremere wie -185°C bis +300°C, die die Grenzen Ihrer Versuchsanordnung abdecken.

  7. F: Wie wird dieser Mikro-Wärmeflussmesser-Chip installiert?
    A: Er wird in der Regel eng an der Oberfläche des zu testenden Geräts angebracht, wobei Wärmeleitpaste oder mechanischer Druck verwendet wird, um guten thermischen Kontakt und minimale Messfehler zu gewährleisten.

  8. F: Welche Daten misst er?
    A: Zwei Kerndatenpunkte: Wärmeflussdichte (W/m² oder W/cm²) und die eigene Temperatur des Sensors (°C).

  9. F: Ist seine Kalibrierung kompliziert?
    A: Relativ komplex. Es erfordert spezielles Standard-Wärmequellen-Equipment, um eine Funktion zwischen Spannungsausgang und bekanntem Standard-Wärmefluss herzustellen. Eine regelmäßige Kalibrierung durch den Hersteller oder zertifizierte Institute wird empfohlen.

  10. F: Was kann er außer Wärmefluss noch messen?
    A: Durch seine Temperaturmessfunktion kann er indirekt Parameter wie Wärmeleitfähigkeit und Kontaktwärmewiderstand.

  11. F: Wie unterscheidet er sich von einem Wärmebildgerät?
    A: Ein Wärmebildgerät misst die Oberflächentemperaturverteilung (2D) – das Ergebnis. Ein Wärmeflussmesser misst die Energieübertragungsrate (1D) – den Prozess. Beide werden oft ergänzend verwendet.

  12. F: Welche Spezifikationen sollte ich beim Kauf beachten?
    A: Fokus auf: Reichweite, Empfindlichkeit, Ansprechzeit, Genauigkeit, Betriebstemperaturbereich, Chipgröße und Verpackungsbeständigkeit.

  13. F: Was sind häufige Fehlerquellen beim Testen?
    A: Hauptsächlich Kontaktwärmewiderstand (schlechter Kontakt zwischen Sensor und Oberfläche), die Störung des thermischen Feldes durch den Sensor und Temperaturänderungsraten, die seine Reaktionsfähigkeit übersteigen.

  14. F: Wie lange ist seine Lebensdauer?
    A: Es hängt von der Einsatzumgebung ab. Häufige extreme thermische Schocks beschleunigen die Alterung. Eine regelmäßige Sensitivitätskalibrierung wird empfohlen, und ein Austausch ist nach Überschreiten des Kalibrierzyklus oder bei physischen Schäden erforderlich.

  15. F: Was sind die Anforderungen an das Datenerfassungssystem?
    A: Eine hochauflösende, hochabtastrate Datenerfassungskarte ist erforderlich, um die schnell wechselnden winzigen Spannungssignale während des thermischen Schocks genau aufzuzeichnen.

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