Xitoy, Guangdong viloyati, Dongguan shahri, Hongmei tumani, Shugang prospekti, 1-qavat, 3-raqam

20 yillik atrof-muhit sinov kamerasi ishlab chiqaruvchisiDunyo bo'ylab 3000+ mijozlarga yetkazib berishlar           Elektron pochta: shirley@deruitest.com
Global Konsultatsiya Hotline:+86 15580327593

Chip yuqori va past harorat shok issiqlik oqimi o'lchagichi

The DERUI semiconductor temperature forcing system delivers rapid hot and cold air directly to ICs, memory, PCBs and optical modules for powered DUT characterization, failure analysis and ATE testing.

Air Range: −65°C to +225°C
Changeover: −55°C to +125°C in 13 s (stated air-stream transition)
Air Flow: Up to 18 SCFM
Control: ±1°C stated; 0.1°C display resolution
Cooling: Mechanical refrigeration; no liquid nitrogen stated
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Localized Thermal Stream for DUT Testing

Rapid Temperature Forcing for Semiconductor and Electronics Validation

The DERUI semiconductor temperature forcing system delivers a controlled hot or cold air stream directly to a device under test. It supports fast characterization of ICs, memory, PCBs, optical modules and 5G components while the DUT remains connected to electrical test equipment.

−65°C to +225°CStated outlet-air operating range
13 s ChangeoverStated −55°C to +125°C air transition
Up to 18 SCFMConditioned-air flow
No LN₂ RequiredMechanical refrigeration system
Correct Product Category

This Is a Temperature Forcing System—not a Heat Flux Meter

A heat flux meter measures heat-transfer rate per unit area. This equipment instead creates and controls a localized thermal environment around a DUT. The technically correct search terms are temperature forcing system, thermal stream or thermostream system.

IC Characterization

Measure functional and electrical behavior at hot, cold and intermediate case-temperature conditions.

Memory and Storage

Test Flash, eMMC and related devices for startup, timing and data performance across temperature.

5G and Optical Modules

Condition SFP/transceiver modules, RF devices and communication boards while connected to ATE or a functional test setup.

Important measurement boundary: outlet-air temperature, DUT case temperature and semiconductor junction temperature are different values. Define which temperature controls the test and where the feedback sensor is installed.
Qanday ishlaydi

Focused Hot and Cold Air Around the DUT

1

Generate the Air Stream

Mechanical refrigeration and electric heating condition the process air over the selected operating range.

2

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3

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Sovutish usuli Mechanical refrigeration; no liquid nitrogen stated
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Selection Checklist

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Laboratory Utilities

Supply voltage, compressed/dry-air requirement, heat rejection, exhaust, noise limit and available floor/bench space.

Typical Workflow

Integrating Thermal Stream with ATE

1

Characterize the Setup

Verify sensor placement, shroud sealing and the relationship between air, case and any estimated junction temperature.

2

Run the Sequence

Command the target, wait for the agreed stabilization rule, execute the electrical test and record temperatures with results.

3

Return Safely

Warm the DUT above the condensation-risk point before opening the shroud or removing it from dry-air protection.

Ko‘p so‘raladigan savollar

Semiconductor Temperature Forcing System FAQs

What is a semiconductor temperature forcing system?

It delivers controlled hot or cold air to a localized DUT so electrical behavior can be measured at selected temperatures without conditioning a full chamber.

Is it a heat flux meter?

No. It does not primarily measure heat flux in W/m². It is a thermal-stream source and temperature-control system.

Does the DUT reach −55°C to +125°C in 13 seconds?

Not necessarily. The figure describes the stated air transition. DUT stabilization depends on thermal mass, power, fixture, airflow, sensor and tolerance.

Why use it instead of a temperature chamber?

It provides faster localized conditioning and easier access to probes, sockets and ATE, making it useful for device characterization and failure analysis.

Can it control junction temperature?

Directly controlling junction temperature requires a suitable electrical sensing or thermal model. Standard setups more commonly control air or package-case temperature.

Does it require liquid nitrogen?

The supplied specification states mechanical refrigeration without LN₂. The system still contains a closed refrigeration circuit; refrigerant type and service details should be confirmed.

How is condensation prevented?

Use dry conditioned air, a well-sealed shroud, controlled purge and warm-up, and keep the DUT protected until it is above the ambient dew point.

What should I send for selection?

Provide DUT/fixture drawings, power dissipation, target temperature, sensor/control point, transition and stability requirements, test sequence and laboratory utilities.

Configure the Thermal Stream Around Your DUT

Send DERUI your device, socket and fixture drawings, power dissipation, temperature profile, feedback method and ATE sequence. We will review the nozzle/shroud, airflow and control configuration.

Request a DUT Thermal Review

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Harorat diapazoni
-65 °C dan + 225 °C gacha
Haroratning tipik o'zgarish tezligi
"-55°C dan + 125 "C gacha;≤; 13 soniya
Harorat nazorati aniqligi
± 1 °C
Displey/sozlash aniqligi
± 0.1 °C
Tizim gaz oqimi
4-18 SCEM (1.9L/s-8.5L/s)
Tizim ishlash
Hd Rangli sensorli ekran, 7" TET
Tizim tili
Xitoy/Ingliz
Ishlash rejimi
Qoʻllanma rejimi yoki dastur rejimi
Aniqlash rejimi
Havo, DUT
Haroratni boshqarish
Ichki: TC; Masofadan/eksternal: T, K; Ixtiyoriy: RTD
Aloqa interfeysi
RS-232, LAN; Ixtiyoriy: GPIB
Konditsioner
HCFC atrof-muhit konditsioneri
Ko'tarish boshqaruvi
Ko'tarish çubuği: elektr; BOSHI: pnevmatik boshqaruv; Bu operatsiya mahalliy yoki masofadan interfeys orqali amalga oshiriladi
Qo'l uzaytirish
X: 1300mm, Y: 400mm, Z: 360°
Isitish ekranining o'lchami
Standart: 140mm; Boshqalar: Ф74mm/Ф178mm (turli o'lchamlarda sozlash imkoniyati bilan)
Asosiy dvigatel o'lchami
638mm * 970mm * 970mm (uzunlik * kenglik * balandlik)
shovqin
≤59DBA
og'irligi
205KG
Quvvat talablari
220VAC/50Hz, 30Amp, 1Faza
Havo manbai talabi
 
gaz
Toza havo: yog' molekulalari, namlik va zarrachalarsiz
Qabul qilish harorati
+15 °C dan +25 °C gacha
Qabul qilish bosimi
90-110 Psig (6.2-7.6Bar)
Qabul qilish oqim tezligi
15-30 SCFM (7.2 dan 14.3L/s gacha), standart 25SCFM (11.8L/s)
Dew nuqtasi
< 10°C@ 6.2Bar (90Psi), -20°C dan past dew nuqtali quruq gaz tavsiya etiladi
Gazdagi yog' miqdori
≤ 0.01 ppm, moy bilan ifloslanishning 0.01 mikronli filtrigacha
Ish muhitiga qo'yiladigan talablar
 
harorat
+15 °C dan + 25 °C gacha
Nisbiy namlik
20% dan 65% gacha
  1. Savol: Chipning yuqori va past haroratli zarba issiqlik oqimi o'lchagichi nima?
    A: Bu tez yuqori va past harorat o'zgarishlari (termik zarba) paytida chiplar kabi kichik qurilmalar yuzasida issiqlik oqimi zichligini aniq o'lchash uchun ishlatiladigan nozik sensordir.

  2. Savol: Uning asosiy ishlash printsipi nima?
    A: Asosiy printsip shunga asoslangan Zeebek effekti. Sensor chipida mikro-termopillar mavjud bo'lib, ular chip bo'ylab harorat farqi paydo bo'lganda kuchlanish signalini hosil qiladi, bu issiqlik oqimi zichligiga proportsionaldir.

  3. Savol: Nega maxsus "zarba" issiqlik oqimi o'lchagichi kerak?
    A: Oddiy issiqlik oqimi o'lchagichlari sekin javob berish vaqtiga ega. "Zarba" turi o'tkinchi issiqlik o'zgarishlarini kechikish yoki buzilishsiz ushlash uchun juda yuqori javob tezligi va barqarorlikni talab qiladi.

  4. Savol: Uning eng muhim ishlash ko'rsatkichi nima?
    A: Issiqlik javob berish vaqti—sensorning harorat o'zgarishlariga qanchalik tez javob berishi—odatda juda qisqa bo'lishi kerak (millisekund darajasida).

  5. Savol: U asosan qaysi sohalarda qo'llaniladi?
    A: Elektron chipning ishonchliligini tekshirish, akkumulyator batareyalarining termik boshqaruvini tekshirish, aerokosmik materiallarning termik charchoq sinovi, LED lampalarining issiqlik tarqalishini baholash va boshqalar.

  6. Savol: Testim uchun to'g'ri harorat oralig'ini qanday tanlashim mumkin?
    A: Sinov standartlaringiz asosida tanlang. Umumiy diapazonlar -80°C dan +200°C gacha yoki yanada ekstremalroq bo‘lib, -185°C dan +300°C gacha bo‘lib, tajriba sharoitlaringiz chegaralarini qamrab oladi.

  7. Q: Bu mikro issiqlik oqimi o‘lchagich chipi qanday o‘rnatiladi?
    A: Odatiy holda, u sinov ob'ektining yuziga termal pasta yoki mexanik bosim yordamida yaqin joylashadi, yaxshi termal kontaktni ta'minlash va o‘lchash xatosini minimal darajada saqlash uchun.

  8. Q: U qanday ma'lumotlarni o‘lchaydi?
    A: Ikki asosiy ma'lumot nuqtasi: issiq oqim zichligi (W/m² yoki W/cm²) va sensorning o‘z harorati (°C).

  9. Q: Uning kalibrlash jarayoni murakkabmi?
    A: Nisbatan murakkab. Bu maxsus standart issiqlik manbai uskunasini talab qiladi, u voltaj chiqishi va ma'lum standart issiqlik oqimi o‘rtasidagi funksiyani o‘rnatadi. Doimiy kalibrlash ishlab chiqaruvchi yoki sertifikatlangan muassasalar tomonidan tavsiya etiladi.

  10. Q: Issiqlik oqimidan tashqari, u nima o‘lchay oladi?
    A: Harorat o‘lchash funksiyasi orqali, u bilvosita parametrlarni tahlil qilishi mumkin, masalan: termal o'tkazuvchanlik va kontakt termal qarshilik.

  11. Q: U termal tasvirlovchi bilan qanday farq qiladi?
    A: Termal tasvirlovchi yuzaki harorat taqsimotini (2D) o‘lchaydi—natija. Issiqlik oqimi o‘lchagichi energiya transferining tezligini (1D) o‘lchaydi—jarayon. Ular ko‘pincha birga ishlatiladi.

  12. Q: Sotib olayotganda qanday texnik xususiyatlarni hisobga olishim kerak?
    A: Diqqat markazida: diapazon, sezuvchanlik, javob vaqti, aniqlik, ishlash harorat diapazoni, chip o‘lchami va qadoqlash chidamliligi.

  13. Q: Test davomida keng tarqalgan xato manbalari nima?
    A: Asosan: kontakt termal qarshilik (sensor va yuzaning o‘rtasidagi yomon kontakt), sensorning termal maydonni buzishi va harorat o‘zgarishining uning javob imkoniyatidan oshishi.

  14. S: Uning xizmat muddati nima?
    A: Bu foydalanish muhitiga bog‘liq. Tez-tez ekstremal issiqlik shoklari yoshartishni tezlashtiradi. Doimiy sezgirlik kalibrlash tavsiya etiladi, va kalibrlash tsikllaridan oshib ketganda yoki jismoniy shikastlangan taqdirda almashtirish zarur.

  15. S: Ma'lumotlarni olish tizimining talablari nima?
    A: Tez o‘zgarayotgan kichik kuchlanish signallarini aniq yozib olish uchun yuqori aniqlikdagi, yuqori namuna olish tezligiga ega ma'lumotlar olish kartasi kerak.

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